Words Ending In Iod 5 Letters
Words Ending In Iod 5 Letters – AMD Zen 4 Ryzen 9 7950X and Ryzen 5 7600X Review: Bringing the Top Back by Ryan Smith & Gavin Bonshor on September 26, 2022 9:00 AM EST
We’ll start our look at the Ryzen 7000 silicon with the glue that holds the chip together: the I/O Die (IOD). Whether it’s a 7600X or 7950X – one CPU chiplet or two – every Ryzen 7000 processor gets one of AMD’s new IODs.
Words Ending In Iod 5 Letters
As with the Ryzen 3000/5000 series, the IOD is a die separate from the CPU core chiplets that supports anything other than CPU cores or L1/L2/L3 related slots. By creating a 2 or 3 chiplet solution instead of a monolithic die, AMD can put silicon that does not require expensive processing at a low cost, while enjoying the yield benefits from small chiplets and adults. , the mature threshold.
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And that said, for the Ryzen 7000 series it’s AMD’s IOD that gets the biggest boost. Originally developed on GlobalFoundries’ 14nm / 12nm process together, the Ryzen 7000 IOD has made its way to TSMC. The new IOD is made on TSMC’s 6nm process, a generation behind the 5nm process used for the CPU chiplets themselves, but a generation (and some) ahead of GlobalFoundries’ smaller process.
Since AMD no longer has a strong tie to GloFo and the required wafer sharing agreement, AMD is free to create chips like IOD where they see fit. With AMD doing well as a company in the last few years, they don’t need to create IOD and GloFo to fulfill what they want to buy in the fab.
TSMC’s leap to 6nm brings many advantages to AMD’s mid-range chiplets. The smaller system space allows for more transistors – 3.4B and 122m2 die, 63% more than before – which AMD can invest in new features like integrated graphics. Also, a well-designed gate reduces the power requirements of the IOD, especially in situations that are close to useless, although AMD relies on a lot more than the design process here.
In terms of operations, IOD was initially responsible for the implementation of the CPU side of all the new features of the AM5 platform. So PCIe 5.0 root camp, DDR5 memory support, improved display I / O, and others are implemented here. In relation to the Ryzen 3000/5000 IOD then, there is almost nothing here that AMD has not done in some work; even those responsible for cables and endless fabrics have been changed for this generation of processing.
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Outside of the obvious benefits from moving to a smaller processor, the Ryzen 7000 IOD also gave AMD the opportunity to implement everything they’ve learned over the past 3 years about power management and power optimization from the Ryzen mobile lineup. Since the last generation IOD was released for the Ryzen 3000 family in 2019, AMD has released the Ryzen 6000 Mobile CPU, a monolithic die model that has continued to improve power efficiency and integration to catch up with Intel. Ryzen 6000 Mobile introduced power features such as SVI3, which had been carried over to the Ryzen 7000 design, and were initially presented as part of the IOD.
This is easy for AMD as the IOD is designed on the same 6nm process as the Ryzen 6000 Mobile chips. Which means that the new IOD has been able to implement many of the same power gating, power binning, deep sleep mode, clock gating, and power state features previously introduced for mobile. Which is to say that AMD has put a lot of work into making IOD less efficient.
The Ryzen 7000 also inherits many of the storage features of the Ryzen 6000 Mobile platform. AMD is still using their own proprietary storage solutions inside the IOD. And the new chip is in line with Microsoft’s Pluton plan – and all the mixed reviews that will come from that.
Among the other 1.31B transistors in AMD’s new IOD, one big expense against the budget comes from the long-awaited inclusion of integrated graphics and high-end Ryzen desktop parts. Until recently, AMD’s high-end Ryzen processors did not include integrated graphics; both the first monolithic parts and later the chiplet-type parts have abandoned them for cost and related factors. And now with AMD’s modern RDNA 2 graphics card and TSMC manufacturing process, AMD has finally seen the light (ray traced), and is building a small GPU block in the IOD to provide integrated graphics in the Ryzen 7000 product range.
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To be sure, this iGPU is not powerful – nor should it be. Using only 2 CUs (with RDNA 2 dual compute unit technology), it offers one-sixth the number of CUs in AMD’s top-end Ryzen Mobile APUs, or in the more intelligent Radeon RX 6400 down. So this is not a design intended to replace a traditional AMD APU in a laptop or desktop environment. No less, it is an implementation of the RDNA 2 architecture – ray tracing and all – in a low performance configuration.
The idea behind including an iGPU here is to provide a more modern graphics implementation across the Ryzen 7000. Although not fast, 2 CUs running up to 2.2GHz will be fast enough for desktop work – and maybe even some light games. This makes Ryzen’s high-end lineup more suitable for desktop applications and inclusion in OEM desktop systems without dedicated GPUs, a market area that AMD was previously locked into and Intel has pretty much free reign. And even for users who bring their own GPU, the integrated GPU makes troubleshooting easier, since it does not require a separate video card to run the process.
Besides enabling basic pixel processing, another main function of the Ryzen 7000 iGPU is to enable video processing and video production tasks expected from modern GPUs. As this part comes from the integrated GPU and when entering the Ryzen 6000 Mobile (Rembrandt), it comes with well-known features. That includes AV1, HEVC, and H.264 video decoding, as well as HEVC and H.264 video encoding. And, as AMD is eager to explain, these video code / decode blocks are still available even with a special GPU in play; so unless the user disables the iGPU, any Ryzen 7000 system will have access to modern video codecs and features.
Meanwhile on the display controller side, this is the block that enables the Ryzen 7000 CPUs to drive a 4K @ 60Hz display. The iGPU display controller can drive the HDMI 2.1 bus up to its maximum 48Gbps data rate, or it can drive the DisplayPort 2.0 output up to the UHBR10 data rate (a feature not found on NVIDIA’s upcoming RTX 40 card). And as mentioned before when talking about motherboards and chipsets, motherboard vendors will have the option of exposing these DP devices through USB-C alt mode, or by implementing DisplayPorts. Everything, in turn, can be used as an active display even if a special video card is installed, through AMD’s new hybrid model.
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All told, AMD takes the same approach as Intel here in their desktop CPUs. Most (but not all) Intel desktop components have UHD-class cores integrated with Xe-LP GPUs, which Intel does for many of AMD’s current reasons. AMD has a leg up on Intel even though they offer new architecture and great features, such as improving AV1. But we will see the bottom performance area; 2 Radeon CUs are so low that these components may not reach Intel’s 32 EU integrated graphics.
The final performance improvement to come with AMD’s new IOD is Infinity Fabric, AMD’s die-to-die interconnect. On the Ryzen desktop side of the chiplet, IF is used to bring a low connection between the IOD and the CPU core chiplet(s) in the package.
For the Ryzen 7000 series, AMD has done some engineering work to reduce the energy costs of the IF link, thus improving the energy efficiency of the link and reducing the data transfer penalty for using chiplet-based methods. The most important thing here is that AMD has doubled the IF connection, but reduced the physical width of the IF connection in half. As a result, the Ryzen 7000’s IF connection provides the same bandwidth as the Ryzen 5000,
According to AMD, this update is because AMD engineers discovered that, contrary to conventional wisdom, they can save energy with a narrow IF connection. Which is to say that, although high frequencies are often used to block power, in the case of IF it is only the physical connection power themselves that is the most expensive part. Part of the change, in turn, comes from the fact that the number of new systems has allowed AMD to connect IF.